Semiconductor Industry

A 0.2μm warp in a FOUP (Front-Opening Unified Pod) door caused vacuum loss – contaminating $500,000 worth of 3nm wafers. Semiconductor equipment demands extreme precision traditional shops can’t deliver.

Vanmodel Sheet Metal builds components for ASML, Lam Research, and Applied Materials suppliers. Here’s how we solve critical semiconductor challenges:

The Flatness Imperative

• Problem: Even 1μm/m² warp breaks vacuum seals in EUV pods
• Solution:
  1. Stress-Relief Aging: 48-hour thermal aging at 300°C stabilizes aluminum
  2. Precision Flattening: Surface grinding to 0.5μm flatness (tested with laser interferometers)
  3. Distortion-Free Welding: Pulsed TIG with argon back-purging

Contamination Control

• Class 5 Cleanrooms: Particle counts <3,520/m³ for critical parts
• Electropolishing: Achieves Ra<0.1μm for ultra-high vacuum surfaces
• Passivation: Citric acid passivation replaces hazardous nitric acid

Speed-to-Fab Advantage

• 10-Day FOUP Prototyping: From CAD to functional pod (vs. industry standard 6 weeks)
• Zero-Particulate Deburring: Magnetic abrasive finishing (MAF) technology

Why Semiconductor Leaders Choose Us:

• Equipment: AMADA LC-3015 F1 6kW laser (±0.03mm precision)
• Materials: 6061-T651 aluminum, 304/316L stainless with certified low outgassing
• Testing: Helium leak testing down to 1×10⁻⁹ Pa·m³/s

*“Vanmodel’s FOUP doors maintained <0.01Pa vacuum for 200+ cycles – matching OEM specifications at 40% lower cost.”* – Semiconductor Equipment Maker

Demand Semiconductor-Grade Precision
Download Our FOUP Flatness Specification Sheet